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Automatic Vision Screen Soldering Paste Printer-GSE

Automatic Vision Screen Soldering Paste Printer-GSE

Digital Solder Paste Printer - GSE Automatic Vision Screen Soldering Paste Printer ( Model:GSE )
 
Specification parameters:
 

Item No X9
PCB Parameters  
Maximum board size (X x Y) 450mm x 350mm
Minimum board size (Y x X) 50mm x 50mm
PCB thickness 0.4mm~14mm
Warpage Max. PCB Diagonal line 1%
Maximum board weight 10kg
Board margin gap Configuration to 3mm
Maximum bottom gap

20mm

Transfer speed 1500mm/s(MAX)
Transfer height from the ground 980 ±40mm
Transfer orbit direction Left-Right , Right-Left, Left-Left, Right-Right (Program Settings)
Transfer mode One stage orbit
PCB clamping method

Programmable flexible side pressure + Adaptive PCB board
thickness + Bottom integral suction cavity vacuum(optional:
1,Multipoint partial vacuum at the bottom;2,Edge locking and
substrate clamping)

Support method

Magnetic thimble, equal high block, vacuum suction cavity, special
workpiece fixture.

Printing parameters  
Printing head Suspended intelligent closed loop printing head (Linear motor)
Template frame size 370mm x 470mm~737 mm x 737 mm
Maximum printing area 450mm x 350mm
Squeegee type

Steel squeegee / Glue squeegee (angle 45°/55°/60°matching the
printing process)

Squeegee length 220mm~500mm
Squeegee height 65 ±1mm
Squeegee thickness 0.25mm Diamond-like carbon coating
Printing mode Single or double squeegee printing
Demoulding length 0.02 mm - 12 mm
Printing speed 0~ 200 mm/S
Printing pressure 0.5- 10Kg
Printing stroke ±200mm From the center
Image parameters  
Field of View 6.4mm x 4.8mm
Platform adjustment range X,Y: ±7.0MM, θ:±2.0°
Benchmark point type

Standard shape benchmark point (SMEMA standard), solder pad /
openings

Camera system

Independent camera, upwards / downwards imaging vision system,
geometric matching location

Performance parameter  
Repetition precision of image calibration ±10.0 micron @6 σ,Cp≥2.0
Repetition precision of printing ±20.0 micron @6 σ,Cp≥2.0
Cycle time < 7s
Product Changeover < 5mins
Equipment  
Power requirements AC220V ±10%,50/60HZ,15A
Compressed air requirements 4~6Kg/cm2, 10.0 Diameter of the tube
Operating system Windows XP
External dimension L1140x W1410x H1480mm
Machine weight Around1000Kg
Temperature and humidity control module (optional)
Environment temperature 23±3℃
Relative humidity 45~70%RH4

 
Feature and function
 
Printer 3M Solder Paste Printer, since it’s simple and reliable structure, accurate positioning and easy to adjust, thereby it can quickly and automatically adjust the pin height for the different thickness of PCB.
The spray nozzle makes the cleaning liquid evenly sprinkled on the wiping paper. The arc-shaped rubber wiper is soft, antiwear and antirust, cleaning thoroughly with the bidirectional strong vacuum.
It’s easy to adjust the width of the wiping paper from 250 to 450mm, and can be used for dry cleaning, wet wiping, wet cleaning, reciprocating cleaning or other purposes.
 
Intelligent Automatic Solder Paste Printer With Windows XP Operating System 0
 
Accurate optical positioning system
 
Advanced upper/lower coaxial optical alignment system with omni-directional light compensation, clear resolution, wide range of process application window, high precision servo motor and the combination of the most advanced ball screw and linear slide rail for more accurate recognizing and capturing the images.
The outstanding stability can ensure the coincident accuracy of PCB and stencil.
 
Intelligent Automatic Solder Paste Printer With Windows XP Operating System 1
 
Zero pressure feedback protection system
With the squeegee pressure feedback system, we can intelligently adjust the depth of the squeegee and ensure the pressure value invariably in printing process,there by to achieve the best process control for the perfect printing of high-density and fine pitch devices.
The pressure data measured in real time, it can be used for the statistic and monitoring of process control.
 
Intelligent Automatic Solder Paste Printer With Windows XP Operating System 2
 
High efficiency and high adaptability stencil cleaning system
 
Siphonic and programmable atomizing nozzle and cleaning fluid can be any combination of dry, wet and vacuum cleaning methods for cleaning thoroughly.
The soft antiwear rubber squeegee is easy to disassemble and cleaning thoroughly.
 
Intelligent Automatic Solder Paste Printer With Windows XP Operating System 3


2D solder paste printing quality inspection and SPC analysis

 

The 2D function can quickly detect the defects such as offset, less tin, missed printing, and even tin, and the detection points are arbitrarily increased. The SPC software can analyze the CPK index of the machine through the samples collected by the machine to ensure the printing quality.