PICK AND PLACE

full auto solder paste printer machine

full auto solder paste printer machine

Detail Description:

full auto solder paste printer machine

General Introduction:

1.Product Functions:

 a high accuracy printing robot designed for high precision screen printing or stencil printing in SMT industry.

2.Product Features:

i.Support spectrums of PCB sizes from 50mm x 50mm to 450mm x 340mm and PCB thickness from 0.8mm to 6mm.

ii.High printing accuracy

1.High positioning accuracy, repeated positioning accuracy ±0.008mm; printing accuracy ±0.015mm.

2.Support glue printing

iii.Automatic control improves production efficiency, quality control and cost saving:

1.Automatic stencil positioning

2.Automatic PCB calibration

3.Programmable squeegee pressure

4.Automatic printing

5.Automatic stencil cleaning (dry-type, wet-type and vacuum-type)

iv.Adopt company independently developed suspended print head and Programmable pressure adjustment system. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect forming effect of solder paste.

v.Programmable motor controls separation speed and distance among the squeegee, stencil and substrates, to realize multi-method separation.

vi.Multi-functional PCB fixed positioning system, convenient and accurate PCB positioning.

vii.Upward and downward visual positioning.

viii.Built-in image processing system

ix.Support 2D, SPC functions   

3.Applicable pitches of Components

i.SMT Components such as resistors, capacitors, inductors, diode and triode: 010035, 0201, 0402, 0603, 0805, 1206 and other specifications.

ii.IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm ;

iii.Printing size:50mm x 50mm ~450 mm x 340 mm

iv.PCB Thickness: 0.8mm ~ 6mm

v.FPC Thickness: thickness≦ 0.6 mm (excluding jig)

 

Specification:

 The following data is obtained under ambient temperature of 25 ℃ and humidity of 60%

Items

                Parameter

Repeat Position Accuracy

±0.008mm

Printing Accuracy

±0.015mm

Cycle Time

<8s (Excluding Printing & Cleaning)

Products Changeover

<5Min

Screen Stencil Size/Min

470mm*370mm

Screen Stencil Size/Max

737mm*737mm

Screen Stencil Size/Thickness

20mm ~ 40mm

PCB Size/Min

50*50mm

PCB Size/Max

400*340mm

PCB Thickness

0.6~6mm

PCB Warpage Ratio

<1%(Based on diagonal length)

Platform to Board distance 

13mm(standard configuration),25mm(optional configuration)

Edge to Board rim distance

3mm

Transport Height

900±40mm

Transport Direction

Left-Right; Right-Left; Left-Left; Right-Right

Transport Speed

100-1500mm/sec Programmable

Board Location

Support System

Magnetic pin/Side support block/Flexible automatic pin(optional)

Clamping System

Elastic side clamping/Vacuum nozzle/Elastic Z-direction tablet (Optional)

Print head

Programmable motor driven print head/ Integrated motor driven and pneumatic control print head (Optional)

Squeegee Speed

10~200mm/sec

Squeegee Pressure

0-15kg programmable (Standard)/ 0~0.5MPa with adjustable pressure reducing meter valve (Optional closed-loop pressure feedback system)

Squeegee Angle

60°(Standard)/55°/45°

Squeegee Type

Steel squeegee (standard), rubber squeegee, customizable other types of squeegee

Stencil Separation Speed

0.01~10mm/sec Programmable

Cleaning Method

Dry-type, wet-type, vacuum-type ( Programmable combination of Cleaning methods)

Table Adjustment Range

X: ±4mm;Y:±6mm;θ:±2°

Type of Image Fiducial Mark

Standard geometry shape of fiducial mark, bonding pad / stencil apertures

Camera System

Single digital camera with upward/downward vision system

Air Pressure

4~6Kg/cm2

Air Consumption

Approx 0.07m3 /min

Control Method

PC Control

Power Supply

AC:220±10%,50/60HZ 1Φ 1.5KW

Machine Dimensions

1250mm(W)*1450mm(D)*1540(H)mm (excluding height of indicating lighthouse)

Weight

Approx:1100Kg

Operation Temperature

-20°C ~ +45°C

Operation Humidity

30%~60%