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SMT PCB 4 Heating Zone Lead Free Wave Soldering Macine

SMT PCB 4 Heating Zone Lead Free Wave Soldering Macine

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SMT PCB 4 Heating Zone Lead Free Wave Soldering Macine

 

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  • SMT PCB 4 Heating Zone Lead Free Wave Soldering Macine

    SMT PCB 4 Heating Zone Lead Free Wave Soldering Macine   Parameter   Model No.  N450 Controlling PC+Siemes PLC Conveyor Motor 1P AC220V,60W Conveyor Speed 0-2000mm/min PCB Width 50-350mm(W) Fux Capacity 6L Conveyor Height 750±20 mm Air Supply 5kg/cm²  12Nl/min Preheating Zones 4 Hot Air, Independent Temperature Control Length of Heating Zones 2000mm Range of Temp. Setpoint Room Temperature---250ºC Solder Pot Heating 1KW*9PCS, Room Temperature---300ºC Wave Height Approx.12mm Solder Pot Volume 420KGS Solder Pot Temperature Room Temperature---300ºC(Ajustable) Wave Motor 3P AC220V,0.18KW*2PCS Nail Clean Pump 1P AC220V 6W Conveyor  Direction L→R (R→L Pptional) Welding Angle 4-7º Flux Pressure 3-5BAR

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  • Economical SMT Lead Free Wave Soldering Machine For DIP Procuction Line

    Economical SMT Lead Free Wave Soldering Machine For DIP Production Line Parameter Introduction 1. Energy-saving, lead-free application, meet with environmental protection requirement and user friendly designed 2. Automatic power system, inverter control, automatic board in-load feature. 3. Flux sprayer using transverse Japanese spray nozzle and driving by pneumatic cylinders. PLC controlled, accurate and reliable. 4. Preheating system uses three independent temperature control so as to ensure the excellent heat preservation, temperature uniformity, temperature accuracy in ±2ºC. 5. Titanium solder fingers, high strengthened double v-groove with tin resistant 6. Solder motor adopts imported high frequency conversion motor with independent control, stable performance. 7. Pre-heat passage with modularized design, environmental protection and safety, convenient for cleanup. 8. PID close loop controlled hot air pre-heaters 9. Timer startup feature for solder pot, solder melted in within 90 minutes. 10. With black box memory function, the machine can always store the SPC data, improve work efficiency. 11. Automatic finger cleaner equipped. 12. Intelligent monitoring and alarm system ensure the stable performance and operators’ safety.

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  • DIP Line Dual Wave Soldering machine/Lead-free Wave Solder

    DIP Line Dual Wave Soldering machine/Lead-free Wave Solder N300   Features: 1.Stepper motor driven flux sprayer, spray range is selective, save more flux. 2.Flux recovery container drawer design, easy to clean. 3.Conveyor passage add 1 more width ajustable screw, total 3 screws, the conveyor transmission is more stable, no PCB falling risk. 4.Solder pot's inpeller material is cast iron, never corrode. 5.Solder pot with oxidation jacket, low solder dross Specification: Number of heating zones         2 Length of heating zones          1200mm Body size                                 2800(L)*1250(W)*1560(H) Outside dimension                   3600(L)*1250(W)*1560(H) Weight                                     1000KG Total/running power                 16KW/6KW Air supply                                 0.5MPa Preheating method                  IR(standard)/Hot air Preheating power                    220V 6KW Control method                        PC +PLC/Touchtone/Touch screen Range of temp.control             Room temperature---300ºC Preheating time                       About 10-15mins for setting 150ºC Solder type                              Lead-free / Sn-Pb Solder pot capacity                  280KG Solder pot temperature            300ºC Solder power                            380V 8KW Solder temp. control method    PID&SSR Wave crest drive power           1KW 220V Warm-up time of solder            About 120mins for setting 250ºC PCB width                                50-300mm Convey speed                         300-1800mm/min Convey direction                      L→R (R→L optional) Convey angle                          4-7 º Flux pressure/capacity            3-5 bar/6L

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  • Hot Air Lead Free DIP Mini Wave Soldering Machine N250

     Hot Air Lead Free DIP Mini Wave Soldering Machine N250 Introduction: 1. Automatic conveying power system and auto synchronous board feeding functions. 2.Tin stove peak uses frequency conversing speed adjustment which can independently control the wave peak height. 3.Flux sprays system using scanning spray nozzle, Japanese nozzles and rodless pneumatic cylinders and PLC control, accurate and reliable. 4. PLC is used to control the machine, to ensure the reliability and stability of the system. 5.With Remote Infrared Ceramic heating pipe preheating device, heat radiation directly to the circuit board bottom, fast heating and stimulate the full activity of flux. 6.Special alloy transportation chain claws, non-stick tin and ensures the quality of welding PCB board. 7.Tin stove adopts imported high frequency conversion motor independent control, stable performance. 8. Lead-free solder furnace with independent design, environment protection and safety, easy to clean. 9. Preheating system uses three independent temperature control so that ensure the excellent heat preservation, temperature uniformity, temperature difference no more than ±2ºC. 10.Time can be controlled, we can preset switch functions, tin stove can heat within 90 minutes. 11.Reasonable design and sensitive fault security alarm system ensure the stable performance and operators’ safety. Specification: Model No. N250 Number of Pre-heaters 2 Pre-heater Passage 800mm Body Size 1800(L)*1200(W)*1600(H) Outside Dimension 2500(L)*1200(W)*1600(H) Weight 800KG Total/Steady consumption 11KW/4-6KW Air Supply 0.5MPa Preheating Style Hot air Preheater Consumption 220V 5KW Control  Method Button+PLC (Option: Touch Screen, PC) Range of Temp. Set-point Room Temperature---300℃ Preheating Time About 10-15mins for Setting 150℃ Solder Application Lead-free / Sn-Pb Solder Pot Capacity 220KG Solder Pot Temperature 300℃ Solder Pot Consumption 380V 6KW Solder Temp. Control Method PID&SSR Wave Motor Power 180

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  • SMT PCB Assembly Line wave soldering machine for DIP Production Line

    SMT PCB Assembly Line wave soldering machine for DIP Production Line  Model No  N200 Number of heating zones 1 Length of heating zones 450mm Body size 1400*1200*1600 Outside dimension 2100*1200*1600 Weight 700KG Component lead Within 10 mm Total/running power 9KW/3-5KW Air supply 0.5MPa Preheating method IR(standard) Preheating power 220V 5KW Control  method Press key +PLC(Option: touch screen, PC) Range of temp. control Room temperature---300ºC Preheating time About 10-15mins for setting 150ºC Solder type Lead-free / Sn-Pb Solder pot capacity 180KG Solder pot temperature 300ºC Solder power 380V 6KW Solder temp. control method PID&SSR Wave crest drive power 500W 220V Warm-up time of solder About 120mins for setting 250ºC PCB  width 50-250mm Convey  speed 300-1800mm/min Convey  direction L→R (R→L optional) Convey   angle 4-7 º Flux pressure 3-5 bar Flux capacity 3.2L   Introduction: 1. Automatic conveying power system and auto synchronous board feeding functions. 2.Tin stove peak uses frequency conversing speed adjustment which can independently control the wave peak height. 3.Flux sprays system using scanning spray nozzle, Japanese nozzles and rodless pneumatic cylinders and PLC control, accurate and reliable. 4. PLC is used to control the machine, to ensure the reliability and stability of the system. 5.With Remote Infrared Ceramic heating pipe preheating device, heat radiation directly to the circuit board bottom, fast heating and stimulate the full activity of flux. 6.Special alloy transportation chain claws, non-stick tin and ensures the quality of welding PCB board. 7.Tin stove adopts imported high frequency conversion motor independent control, stable performance. 8. Lead-free solder furnace with independent design, environment protection and safety, easy to clean. 9. Preheating system uses three independent temperature control so that ensure the excellent heat preservation, temperature uniformity, temperature difference no more than ±2ºC. 10.Time can be controlled, we can preset switch functions, tin stove can heat within 90 minutes. 11.Reasonable design and sensitive fault security alarm system ensure the stable performan

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  • Economic-type small wave soldering machineLead-free dual wave soldering machine

    Product Features: 1. Automatic conveying power system, with non-level frequency conversing speed adjustment and auto synchronous board feeding functions. 2. Flux spray system using scanning spray nozzle, Japanese nozzles and rodless pneumatic cylinders and PLC control, accurate and reliable 3. Remote infrared ceramic heating pipes are adopted in the preheating system which ensures good heat preservation effect, high heating up speed and even temperature 4. Special alloy transportation chain claws, non-stick tin, reinforced, and ensures the quality of welding PCB board. 5. Tin stove adopts imported high frequency conversion motor independent control, stable performance. 6. Lead-free solder furnace with independent design, environment protection and safety , easy to clean. 7. Tin heating furnace uses high-speed PID and 2-stept independent outer –heating control, warm-up quickly and eliminates the flaws of stove tin explodes 8. With time controller, can preset switch functions, tin stove machine heating picks up in 90minutes. 9. Reasonable design of environment protection, and automatic washing claw ,ensure the claws clean. 10. The design is reasonable and safe with sensitive fault alarm system ,to ensure the stable performance the safety of operators.  Product parameters: ITEMS SPECIFICATION Model No. YSV-300 Number of heating zones 1 Length of heating zones 800mm Body size 1800(L)*1200(W)*1560(H) Outside dimension 2600(L)*1200(W)*1560(H) Weight 700KG Total/running power 16KW/4KW Air supply 0.5MPa Preheating method IR(standard) Preheating power 220V 5KW Control  method Press key +PLC Range of temp. control Room temperature---300℃ Preheating time About 10-15mins for setting 150℃ Solder type Lead-free / Sn-Pb Solder pot capacity 220KG Solder pot temperature 300℃ Solder power 380V 8KW Solder temp. control method PID&SSR Wave crest drive power 500W 220V Warm-up time of solder About 120mins for setting 250℃ PCB  width 50-250mm Convey  speed 300-1500mm/min Convey  direction L→R (R→L optional) Convey   angle 4—7 º Flux pressure 3-5 bar Flux capacity 6L

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  • soldering equipment/wave soldering system/wave soldering/soldering machine

    product description: 1.Efficient,energy-saving,lead-free, environment-friendly,safe and brand-new design,simple operation,convenient maintenance. 2.Automatic power system, frequency converter control, automatic board input system. 3.Flux sprays system using scanning spray nozzle,Japanese nozzles and rodless pneumatic cylinders and PLC control, accurate and reliable. 4.Preheating system uses 3-stage powerful air system, excellent heat preservation, temperature warm-up, temperature uniformity, no more than ±2oC. 5.Special alloy transportation chain claws, non-stick tin, reinforced, and ensures the quality of welding PCB board. 6.Tin stove adopts imported high frequency conversion motor independent control, stable performance. 7.Lead-free solder furnace with independent design, environment protection and safety, easy to clean 8.Tin heating furnace uses high-speed PID and 2-stept indepent outer-heating control, warm-up quickly and eliminates the flaws of stove tin explodes. 9.With time controller, can preset switch functions, tin stove machine heating picks up in 90minutes. 10.With black box memory function, can always get at production management records, improve work efficiency. 11.Reasonable design of environment protection, and automatic washing claw, ensure the cleanliness of claws. 12.The design is reasonable and safe with sensitive fault alarm system, to ensure the stable performance the safety of operators. Specifications: Model No. YS-350A Number of heating zones 4 Length of heating zones 1800mm Body size 3800*1400*1650 Outside dimension 4600*1400*1650 Weight 1300KG Total/running power 20KW/7KW Air supply 05.MPa Preheating method Micro air Preheating power 220V 10KW Control  method PC +PLC/Touchtone/Touch screen Range of temp. control Room temperature---300oC Preheating time About 10-15mins for setting 150oC Solder type Lead-free / Sn-Pb Solder pot capacity 390KG Solder pot temperature 400oC Solder power 380V 12KW Solder temp. control method PID&SSR Wave crest drive power 1KW 220V Warm-up time of solder About 120mins for setting 250oC PCB  width 50-350mm Convey  speed 300-2000mm/min Convey  direction L→R (R→L optional) Convey   angle 4-7 o Flux pressure/capacity 3-5 bar/6L

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  • lead free medium-sized wave series

    Features：  1. Efficient, energy-saving, lead-free, environment-friendly, safe and brand-new design, simple operation, convenient maintenance. 2. Automatic power system, frequency converter control, automatic board input system 3. Flux sprays system using scanning spray nozzle, Japanese nozzles and rodless pneumatic cylinders and PLC control, accurate and reliable. 4. Preheating system uses 3-stage powerful air system, excellent heat preservation ,temperature warm-up ,temperature uniformity ,no more than ±2℃. 5. Special alloy transportation chain claws, non-stick tin, reinforced, and ensures the quality of welding PCB board. 6. Tin stove adopts imported high frequency conversion motor independent control, stable performance. 7. Lead-free solder furnace with independent design, environment protection and safety , easy to clean 8. Tin heating furnace uses high-speed PID and 2-stept independent outer –heating control, warm-up quickly and eliminates the flaws of stove tin explodes 9. With time controller, can preset switch functions, tin stove machine heating picks up in 90minutes. 10. With black box memory function, can always get at production management records, improve work efficiency. 11. Reasonable design of environment protection, and automatic washing claw, ensure the cleanliness of claws. 12. The design is reasonable and safe with sensitive fault alarm system, to ensure the stable performance the safety of operators. SPECIFICATION： Number of heating zones 2 Length of heating zones 1200mm Body size 2800(L)*1250(W)*1560(H) Outside dimension 3600(L)*1250(W)*1560(H) Weight 1000KG Total/running power 16KW/6KW Air supply 0.5MPa Preheating method IR(standard) Preheating power 220V 6KW Control  method PC +PLC Range of temp. control Room temperature---300℃ Preheating time About 10-15mins for setting 150℃ Solder type Lead-free / Sn-Pb Solder pot capacity 280KG Solder pot temperature 300℃ Solder power 380V 8KW Solder temp. control method PID&SSR Wave crest drive power 1KW 220V Warm-up time of solder About 120mins for setting 250℃ PCB  width 50-300mm Convey  speed 300-1800mm/min Convey  direction L→R (R→L optional) Convey   angle 4—7 º Flux pressure 3-5 bar Flux capacity 6L

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  • SMT wave soldering -wave series

    Features:  Set free spray area, the selectable automatic optimization of the spray path, X, Y two-way linkage point spray, full spray switch freely selectable flow closed-loop control;  Programmatically flexible, flux maximum savings of 70%;  Free combination of preheating module, optionally preheated hot air and infrared;  The maximum capacity of the entire rail transport 60KG, to meet the demanding production needs;  Dross oxidized low volume, a new peak vents designed furnace with automatic lifting function.  Model: YS450  Dimensions (L x W x H): 4350x1620x1710mm  Preheat mode: micro hot air / IR  Number of preheating zone: 3  Tin furnace heating time: About.180MIN (Set: 250 ℃)  Furnace temperature control mode: PID + SSR Mode  PCB width (L x W): 60 ~ 450mm  PCB component height (mm): Top: 120mm; Bottom: 25mm  Cooling: Forced air

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  • Mini and economic-type wave soldering machine

    product description: 1. Automatic conveying power system, with non-level frequency conversing speed adjustment and auto synchronous board feeding functions. 2. Flux spray system using scanning spray nozzle, Japanese nozzles and rodless pneumatic cylinders and PLC control, accurate and reliable 3. Remote infrared ceramic heating pipes are adopted in the preheating system which ensures good heat preservation effect, high heating up speed and even temperature 4. Special alloy transportation chain claws, non-stick tin, reinforced, and ensures the quality of welding PCB board. 5. Tin stove adopts imported high frequency conversion motor independent control, stable performance. 6. Lead-free solder furnace with independent design, environment protection and safety , easy to clean. 7. Tin heating furnace uses high-speed PID and 2-stept independent outer –heating control, warm-up quickly and eliminates the flaws of stove tin explodes 8. With time controller, can preset switch functions, tin stove machine heating picks up in 90minutes. 9. Reasonable design of environment protection, and automatic washing claw ,ensure the claws clean. 10. The design is reasonable and safe with sensitive fault alarm system ,to ensure the stable performance the safety of operators.  Specifications: Number of heating zones 1 Length of heating zones 800mm Body size 1400(L)*1200(W)*1560(H) Outside dimension 2100(L)*1200(W)*1560(H) Weight 500KG Total/running power 16KW/3KW Air supply 0.5MPa Preheating method IR(standard) Preheating power 220V 5KW Control  method Press key +PLC Range of temp. control Room temperature---300℃ Preheating time About 10-15mins for setting 150℃ Solder type Lead-free / Sn-Pb Solder pot capacity 180KG Solder pot temperature 300℃ Solder power 380V 6KW Solder temp. control method PID&SSR Wave crest drive power 500W 220V Warm-up time of solder About 120mins for setting 250℃ PCB  width 30-250mm Convey  speed 300-1200mm/min Convey  direction L→R (R→L optional) Convey   angle 3—6 º Flux pressure 3-5 bar Flux capacity 6L

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  • Full Automatic solder paste Printer YSL-T3 Plus

    Features 1. Auto balance the squeegee pressure which is adjustable 2.Intelligent 2D detection 3.Dry and wet cleaning.Option:vacuumcleaning 4.Option: for thin board printing 5.Advanced mark point recognition technology and stable system capability 6.The first online calibration technology in China     Overall diagram 1.Rack module 2.Lifting module 3.Platform alignment module 4.Housing module 5.Image capture module 6.Stencil frame positioning module 7.Squeegee module 8.Display module 9.Cleaning module 10.Conveyor module 11.Air and power input     Technical parameters     Parameter YSL-T3 Plus/YSL-T3 BTB/YSL-T3 Plus BTB Basic Parameters Screen Frame Size(mm) 520(×)×420(Y)-737(×)×737(Y) Thickness∶ 20-40mm Min PCB(mm) 50(×)×50(Y)mm Max PCB(mm) 400(X)×310(Y) Thickness 0.2mm～6mm( Use jig when pcb less than 0.4mm) Curve <1%(Diagonal measurement) PCB backside Part Height 10mm Conveyor height 900±40mm Support Magnetic support,Magnetic piece,Vacuum chamber(Option) Clamp Side clamp(Standard),please read the option table Edge distance PCB process edge ≥2.5mm Conveyor speed 0~1500mm/s,increment 1mm Conveyor belt U type sync belt Stopper method Air cylinder Stopper position Set the PCB stopper position according to the size of board Flow direction L-R,R-L,L-L,R-R depends on customer Print System Print speed 5-200mm/s adjustable Print head Step motor drive scraper lifting Scraper Steel scraper,rubber scraper(option) Scraper angle 60° Scraper pressure 0~20kg View System Substrate Separation Three-section Substrate Separation；Speed∶0.1-20mm/s；Distance∶0-20mm Alignment position method Mark Automatic aligning Camera Germany BASLER,1/3”CCD,640*480pixel,pixel size 5.6μmx5.6μm Acquire image method Upper/under double photo Camera light Coaxial light,Ring light four kinds light can adjustable View range 9mm*7mm Mark dimensions Diameter or Side length 1mm~2mm,allowable offset 10% Mark shape Cir,Rec,or rhombus etc Mark position PCB dedicated mark or PCB pad 2D detection Standard Accuracy Table adjusting range X=±3mm,Y=±7mm,0=±1.5° Positional accuracy ±0.01mm Printing accuracy ±0.025mm Time Cycle time <10s(ex print,cleaning time) Convert line time <5min Programming time <10min Control System Computer configuration Industrial PC,Windows official system System language Chinese /English Pre and next machine connection SMEMA User authorization User PW and Senior PW set Cleaning System Cleaning system Dry and Wet(standard),vacuum model(optional) Liquid level detection Liquid level auto alarm detection Power Parameters Main power supply AC220V±10%50/60HZ Single phase Total power About 3kw Main air supply 4.5～6kgf/cm2 Machine weight About 900Kg Machine dimensions 1140(L)×1380(W)×1530(H)mm(standard);1675(L)mm(Feed feeding module);1675(L)mm(Add connection module),2210(L)mm(Add material and connect module) Option Pneumatic top clamp For PCB(thickness≤1mm) Top clamp + side clamp For PCB(thickness≤1mm) Vacuum adsorption and clean For PCB(thickness≤1mm)and FPC Auto tin added Auto tin added Auto loading and unloading Auto loading and unloading Flexible and universal support For the Double-sided PCB(PCB backside parts Height ≤9mm) Automatic positioning of screen frame Automatic positioning of screen frame PCB board thickness movement adjustment function PCB board thickness is automatically adjusted Squeegee pressure feedback function Real-time feedback of scraper pressure Air condition Customer can buy by themselves The rest of solder paste on the stencil monitoring system The rest of solder paste on the stencil monitoring system SPI close loop SPI close loop UPS power off protection UPS 15min power off protection Industry 4.0 Bar code trace function,Production analysis,etc

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  • Full Automatic solder paste Printer YSL-T5

    Features 1.Entirety frame design 2.Multifunctional platform design 3.Visual alignment to ensure the accuracy 4.Integrated transport system 5.Independent cleaning structure 6.Squeegee lifting direct connects with screw rod structure     Overall diagram 1.Rack module 2.Lifting module 3.Platform alignment module 4.Image capture module 5.Stencil frame positioning module 6.Squeegee module 7.Display module 8.Cleaning module 9.Conveyor module 10.Air and power input 11.Housing module     Technical parameters     Parameter YSL-T5 Basic Parameters Screen Frame Size(mm) 650(×)×420(Y)-850(×)×850(Y) Thickness∶ 20-40mm Min PCB(mm) 50(×)×50(Y)mm Max PCB(mm) 510(X)×510(Y) Thickness 0.2mm～6mm( Use jig when pcb less than 0.4mm) Curve <1%(Diagonal measurement) PCB backside Part Height 20mm Conveyor height 900±40mm Support Magnetic support,Magnetic piece,Vacuum chamber(Option) Clamp Side clamp(Standard),please read the option table Edge distance PCB process edge ≥2.5mm Conveyor speed 0~1500mm/s,increment 1mm Conveyor belt U type sync belt Stopper method Air cylinder Stopper position Set the PCB stopper position according to the size of board Flow direction L-R,R-L,L-L,R-R depends on customer Print System Print speed 5-200mm/sec adjustable Print head Step motor drive scraper lifting Scraper Steel scraper,rubber scraper(option) Scraper angle 60° Scraper pressure 0~20kg View System Substrate Separation Three-section Substrate Separation；Speed∶0.1-20mm/s；Distance∶0-20mm Alignment position method Mark Automatic aligning Camera Germany BASLER,1/3”CCD,640*480pixel,pixel size 5.6μmx5.6μm Acquire image method Upper/under double photo Camera light Coaxial light,Ring light four kinds light can adjustable View range 9mm*7mm Mark dimensions Diameter or Side length 1mm~2mm,allowable offset 10% Mark shape Cir,Rec,or rhombus etc Mark position PCB dedicated mark or PCB pad 2D detection Standard Accuracy Table adjusting range X=±3mm,Y=±7mm,0=±1.5° Positional accuracy ±0.01mm Printing accuracy ±0.025mm Time Cycle time <10s(ex print,cleaning time) Convert line time <5min Programming time <10min Control System Computer configuration Industrial PC,Windows official system System language Chinese /English Pre and next machine connection SMEMA User authorization User PW and Senior PW set Cleaning System Cleaning system Dry and Wet(standard),vacuum model(optional) Liquid level detection Liquid level auto alarm detection Power Parameters Main power supply AC220V±10%50/60HZ Single phase Total power About 3kw Main air supply 4.5～6kgf/cm2 Machine weight About 950Kg Machine dimensions 1530(L)×1680(W)×1540(H)mm Option Pneumatic top clamp For PCB(thickness≤1mm) Top clamp + side clamp For PCB(thickness≤1mm) Vacuum adsorption and clean For PCB(thickness≤1mm)and FPC Auto tin added / Auto loading and unloading / Flexible and universal support For the Double-sided PCB(PCB backside parts Height ≤9mm) Automatic positioning of screen frame Automatic positioning of screen frame PCB board thickness movement adjustment function Standard Squeegee pressure feedback function / Air condition Customer can buy by themselves The rest of solder paste on the stencil monitoring system / SPI close loop SPI close loop UPS power off protection UPS 15 min power off protection Industry 4.0 Bar code trace function,Production analysis,etc

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  • Full Automatic solder paste Printer YSL-T9

    Features 1.Intelligent, high-precision PCB thickness adjustment platform lifting mechanism 2.Adopts Germany brand screw rod, more stable operation and more accurate positioning 3.The first online calibration technology in China 4.Intelligent 2D check     Overall diagram 1.Rack module 2.Lifting module 3.Platform alignment module 4.Housing module 5.Image capture module 6.Stencil frame positioning module 7.Squeegee module 8.Display module 9.Conveyor module 10.Cleaning module 11.Air and power input       Technical parameters   Parameter YSL-T9 Basic Parameters Screen Frame Size(mm) 650(×)×420(Y)-1000(×)×880(Y) Thickness∶ 20-40mm Min PCB(mm) 50(×)×50(Y)mm Max PCB(mm) 610(X)×510(Y) Thickness 0.2mm～6mm( Use jig when pcb less than 0.4mm) Curve <1%(Diagonal measurement) PCB backside Part Height 20mm Conveyor height 900±40mm Support Magnetic support,Magnetic piece,Vacuum chamber(Option) Clamp Side clamp(Standard),please read the option table Edge distance PCB process edge ≥2.5mm Conveyor speed 0~1500mm/s,increment 1mm Conveyor belt U type sync belt Stopper method Air cylinder Stopper position Set the PCB stopper position according to the size of board Flow direction L-R,R-L,L-L,R-R depends on customer Print System Print speed 5-200mm/s adjustable Print head Step motor drive scraper lifting Scraper Steel scraper,rubber scraper(option) Scraper angle 60° Scraper pressure 0~20kg View System Substrate Separation Three-section Substrate Separation；Speed∶0.1-20mm/s；Distance∶0-20mm Alignment position method Mark Automatic aligning Camera Germany BASLER,1/3”CCD,640*480pixel,pixel size 5.6μmx5.6μm Acquire image method Upper/under double photo Camera light Coaxial light,Ring light four kinds light can adjustable View range 9mm*7mm Mark dimensions Diameter or Side length 1mm~2mm,allowable offset 10% Mark shape Cir,Rec,or rhombus etc Mark position PCB dedicated mark or PCB pad 2D detection Standard Accuracy Table adjusting range X=±3mm,Y=±7mm,0=±1.5° Positional accuracy ±0.01mm Printing accuracy ±0.025mm Time Cycle time <10s(ex print,cleaning time) Convert line time <5min Programming time <10min Control System Computer configuration Industrial PC,Windows official system System language Chinese /English Pre and next machine connection SMEMA User authorization User PW and Senior PW set Cleaning System Cleaning system Dry and Wet(standard),vacuum model(optional) Liquid level detection Liquid level auto alarm detection Power Parameters Main power supply AC220V±10%50/60HZ Single phase Total power About 3kw Main air supply 4.5～6kgf/cm2 Machine weight About 950Kg Machine dimensions 1400(L)×1630(W)×1525(H)mm Option Pneumatic top clamp For PCB(thickness≤1mm) Top clamp + side clamp For PCB(thickness≤1mm) Vacuum adsorption and clean For PCB(thickness≤1mm)and FPC Auto tin added Auto tin added Auto loading and unloading / Flexible and universal support For the Double-sided PCB(PCB backside parts Height ≤9mm) Automatic positioning of screen frame Automatic positioning of screen frame PCB board thickness movement adjustment function Standard Squeegee pressure feedback function Real-time feedback of scraper pressure Air condition Customer can buy by themselves The rest of solder paste on the stencil monitoring system The rest of solder paste on the stencil monitoring system SPI close loop SPI close loop UPS power off protection UPS 15 min power off protection Industry 4.0 Bar code trace function,Production analysis,etc

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  • Full Automatic solder paste Printer YSL-120

    Features 1.Perfect solution for large size product printing 2.Simple calibration and maintenance 3.Stable printing quality 4.Independent developed image processing software     Overall diagram 1.Machine housing module 2.CCD image capture module 3.Stencil lifting module of Z-axis 4.Squeegee printing module 5.Cleaning module 6.Platform fine adjustment module 7.Rail and conveyor module 8.Three color warning lamp 9.Display and input device     Technical parameters   Parameter YSL-120 Basic Parameters Screen Frame Size(mm) 1000(×)×300(Y)-1500(×)×650(Y) Thickness∶ 20-40mm Min PCB(mm) 80(×)×50(Y)mm Max PCB(mm) 1200(X)×360(Y) Thickness 0.2mm～6mm( Use jig when pcb less than 0.4mm) Curve <1%(Diagonal measurement) PCB backside Part Height 15mm Conveyor height 900±40mm Support Magnetic support,Magnetic piece,Vacuum chamber(Option) Clamp Side clamp(Standard),please read the option table Edge distance PCB process edge ≥2.5mm without PCB edge(Option) Conveyor speed 0~1500mm/sec,increment 1mm Conveyor belt U type belt Stopper method Air cylinder Stopper position Set the PCB stopper position according to the size of board Set by software Software Settings Print System Print speed 5-200mm/s adjustable Print head Step motor drive scraper lifting Scraper Steel scraper,rubber scraper(option) Scraper angle 60° Scraper pressure 0~20kg View System Substrate Separation Three-section Substrate Separation；Speed∶0.1-20mm/s；Distance∶0-20mm Alignment position method Mark Automatic aligning Camera Germany BASLER,1/3”CCD,640*480pixel,pixel size 5.6μmx5.6μm Acquire image method Upper/under double photo Camera light Coaxial light,Ring light four kinds light can adjustable View range 9mm*7mm Mark dimensions Diameter or Side length 1mm~2mm,allowable offset 10% Mark shape Cir,Rec,or rhombus etc Mark position PCB dedicated mark or PCB pad 2D detection Standard Accuracy Table adjusting range X=±10mm,Y=±10mm,0=±1.5° Positional accuracy ±0.01mm Printing accuracy ±0.025mm Time Cycle time <10s(ex print,cleaning time) Convert line time <5min Programming time <10min Control System Computer configuration Industrial PC,Windows official system System language Chinese /English Pre and next machine connection SMEMA User authorization User PW and Senior PW set Cleaning System Cleaning system Dry and Wet,vacuum model Liquid level detection Liquid level auto alarm detection Power Parameters Main power supply AC220V±10%50/60HZ Single phase Total power About 3kw Main air supply 4.5～6kgf/cm2 Machine weight About 1500Kg Machine dimensions 2350(L)×1350(W)×1590(H)mm Option Pneumatic top clamp Standard Top clamp + side clamp For PCB(thickness≤1mm) Vacuum adsorption and clean For PCB(thickness≤1mm)and FPC Auto tin added / Auto loading and unloading / Flexible and universal support For the Double-sided PCB(PCB backside parts Height ≤9mm) Automatic positioning of screen frame / PCB board thickness movement adjustment function Standard Squeegee pressure feedback function / Air condition Customer can buy by themselves The rest of solder paste on the stencil monitoring system T/ SPI close loop SPI close loop UPS power off protection UPS 15 min power off protection Industry 4.0 Bar code trace function,Production analysis,etc

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  • Full Automatic solder paste Printer YSL-510H

    Features 1.Perfect solution for large size product printing 2.Simple calibration and maintenance 3.Stable printing quality 4.Independent developed image processing software     Overall diagram 1.Machine housing module 2.CCD image capture module 3.Stencil lifting module of Z-axis 4.Squeegee printing module 5.Cleaning module 6.Platform fine adjustment module 7.Rail and conveyor module 8.Three color warning lamp 9.Display and input device     Technical parameters   Parameter YSL-120 Basic Parameters Screen Frame Size(mm) 650(×)×5500(Y)-737(×)×737(Y) Thickness∶ 20-40mm Min PCB(mm) 50(×)×50(Y)mm Max PCB(mm) 510(X)×510(Y) Thickness 0.2mm～6mm( Use jig when pcb less than 0.4mm) Curve <1%(Diagonal measurement) PCB backside Part Height 18mm Conveyor height 900±40mm Support Magnetic support,Magnetic piece,Vacuum chamber Clamp Side clamp and top clamp Edge distance PCB process edge ≥2.5mm  Conveyor speed 0~1500mm/sec,increment 1mm Conveyor belt U type belt Stopper method Air cylinder Stopper position Set the PCB stopper position according to the size of board Set by software Software Settings Print System Print speed 5-200mm/s adjustable Print head Step motor drive scraper lifting Scraper Steel scraper,rubber scraper(option) Scraper angle 60° Scraper pressure 0~20kg View System Substrate Separation Three-section Substrate Separation；Speed∶0.1-20mm/s；Distance∶0-20mm Alignment position method Mark Automatic aligning Camera Germany BASLER,1/3”CCD,640*480pixel,pixel size 5.6μmx5.6μm Acquire image method Upper/under double photo Camera light Coaxial light,Ring light four kinds light can adjustable View range 9mm*7mm Mark dimensions Diameter or Side length 1mm~2mm,allowable offset 10% Mark shape Cir,Rec,or rhombus etc Mark position PCB dedicated mark or PCB pad 2D detection / Accuracy Table adjusting range X=±10mm,Y=±10mm,0=±2° Positional accuracy ±0.01mm Printing accuracy ±0.015mm Time Cycle time <7.5 exprint,cleaning time) Convert line time <5min Programming time <10min Control System Computer configuration Industrial PC,Windows official system System language Chinese /English Pre and next machine connection SMEMA User authorization User PW and Senior PW set Cleaning System Cleaning system Dry and Wet(standard),vacuum model(optional) Liquid level detection Liquid level auto alarm detection Power Parameters Main power supply AC220V±10%50/60HZ Single phase Total power About 3kw Main air supply 4.5～6kgf/cm2 Machine weight About 1300Kg Machine dimensions 1350(L)×1625(W)×1535(H)mm Option Pneumatic top clamp Standard Top clamp + side clamp For PCB(thickness≤1mm) Vacuum adsorption and clean For PCB(thickness≤1mm)and FPC Auto tin added / Auto loading and unloading / Flexible and universal support For the Double-sided PCB(PCB backside parts Height ≤9mm) Automatic positioning of screen frame Standard PCB board thickness movement adjustment function / Squeegee pressure feedback function / Air condition Customer can buy by themselves The rest of solder paste on the stencil monitoring system / SPI close loop SPI close loop UPS power off protection UPS 15 min power off protection Industry 4.0 Bar code trace function,Production analysis,etc   Precision/Stable/Smart   1The first domestic online calibration technology 2.New squeegee pressure setting software 3.Automatic calibration function-for rail rod wear automatic compensation 4.Intelligent 2D examination 5.New squeegee 6.Each equipment has passed the CPK test,and the test report(PDF file) is available 7.New alcohol cleaning structure                                               Precise Device of Platform Adjustment         Intelligent 2D examination (X-Y-Z Adjust the system)                                                                 Mark Point Identification Technology               Stable Printing Quality          Simple calibration and maintenance     Precision Guarantee

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YUSH Electronic Technology Co.,Ltd. Pomeas Optical Technology Copyright 2016

Model No.

 N450

Controlling

PC+Siemes PLC

Conveyor Motor

1P AC220V,60W

Conveyor Speed

0-2000mm/min

PCB Width

50-350mm(W)

Fux Capacity

6L

Conveyor Height

750±20 mm

Air Supply

5kg/cm²  12Nl/min

Preheating Zones

4 Hot Air, Independent Temperature Control

Length of Heating Zones

2000mm

Range of Temp. Setpoint

Room Temperature---250ºC

Solder Pot Heating

1KW*9PCS, Room Temperature---300ºC

Wave Height

Approx.12mm

Solder Pot Volume

420KGS

Solder Pot Temperature

Room Temperature---300ºC(Ajustable)

Wave Motor

3P AC220V,0.18KW*2PCS

Nail Clean Pump

1P AC220V 6W

Conveyor  Direction

L→R (R→L Pptional)

Welding Angle

4-7º

Flux Pressure

3-5BAR