FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine
1.Extremely short cycle time with rotary table design. Product loading and
unloading can be done during the heat sealing process.
2.High quality heat seal application up to 0.25mm pitch.
3.Pneumatic bonding head provide up to 3,900N force.
4.Digital programmable pressure control with LCD display.
5.Closed loop PID temperature control with visible LED display.
6.Bonding cycle is triggered by a real time pressure sensor.
7.Floating Thermode ensure consistent pressure and heat transfer along
the flexfoil to LCD and/or PCB.
8.Precision product fixtures (2X), easy exchange, provided with micrometer
alignment and vacuum to fix components.
9.Optional CCD alignment module with frame, camera, lens, monitor and
illumination for fine pitch application.
10.Full microprocessor logic control.
Hot bar soldering is extremely effective in bonding components and parts
that are dissimilar and difficult to unite. Several examples are listed above,
but there are many other soldering situations that call hot bar reflow soldering
system. This technology, also known as pulse bonding, differs from traditional
soldering since the reflow process uses thermode technology, which is based
on rapid reflow by pulse heating. This procedure allows materials with low
temperature resistance to be soldered at high lead-free temperatures without
damage to the flex. It selectively solders parts by heating them to a temperature
that's high enough to cause their adhesive or solder to melt and then re-solidify
to form a permanent bond.