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Applications Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting . Features of products • Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc. • Can meet the high precision cutting maximum diameter of 300 mm materials. • High rigidity structure design is adopted to ensure high precision and high stability of cutting process. • CCD automatic positioning and calibration. • Real-time monitoring of the air pressure, water pressure, current and other values of the system to avoid spindle damage. • Cutting spindle: 2.4 kw × 1set (Max: 60,000 rpm) • Repeat positioning accuracy: 0.001mm • Cutting speed: 0.05 ~ 400 mm/sec • Standard collocation blade: 2 Inch (Max: 3 Inch)   
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