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FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine 


1.Extremely short cycle time with rotary table design. Product loading and

unloading can be done during the heat sealing process.
2.High quality heat seal application up to 0.25mm pitch.
3.Pneumatic bonding head provide up to 3,900N force.
4.Digital programmable pressure control with LCD display.
5.Closed loop PID temperature control with visible LED display.
6.Bonding cycle is triggered by a real time pressure sensor.
7.Floating Thermode ensure consistent pressure and heat transfer along

the flexfoil to LCD and/or PCB.
8.Precision product fixtures (2X), easy exchange, provided with micrometer

alignment and vacuum to fix components.
9.Optional CCD alignment module with frame, camera, lens, monitor and

illumination for fine pitch application.
10.Full microprocessor logic control.



FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine with Pulse HeatFPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine with Pulse Heat
FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine with Pulse HeatFPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine with Pulse Heat
 

Parameters:

 

Model:                               YSHP-1A
Size:                                  500mm X 750mm X 910mm
Work Air Pressure:            0.5-0.7MPA
Working Area:                   110mm X 150mm
Temperature setup:           0-400℃
Tolerance of Temp:            +2℃
Time of pressing:                0-99s
Tolerance of  Pressing:       0.05MPA
 

Description:

 

Hot bar soldering is extremely effective in bonding components and parts

that are dissimilar and difficult to unite. Several examples are listed above,

but there are many other soldering situations that call hot bar reflow soldering

system. This technology, also known as pulse bonding, differs from traditional

soldering since the reflow process uses thermode technology, which is based

on rapid reflow by pulse heating. This procedure allows materials with low

temperature resistance to be soldered at high lead-free temperatures without

damage to the flex. It selectively solders parts by heating them to a temperature

that's high enough to cause their adhesive or solder to melt and then re-solidify

to form a permanent bond.






CONTACT US
Contacts:Eva Liu +86 13416743702
Tel:+86-512-62751429
Skype:evaliuhuan
Email:sales@yushunli.com evaliu@hk-yush.com
Address: Building H, GuoRui Pioneering
Park, No. 1068 Jinyang East Road, Lujia Town, Kunshan, Suzhou.
Postcode:215331
Dongguan Factory Address: 5th Floor,
No.10, Shanquan Road, Yongtou Village,
Chang’an Town, Dongguan City, Guangdong province, China.
Postcode:523843
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